Frontiers of Embodied Intelligence (FEI) is an international, peer-reviewed, open access journal dedicated to advancing research on embodied forms of artificial intelligence. The journal focuses on intelligent systems in which perception, cognition, and action are tightly integrated with physical bodies and environments. Embodied intelligence represents a paradigm shift from purely computational intelligence toward systems that learn, adapt, and interact with the real world through sensory-motor experiences.
Editors-in-Chief
Prof. Tianrui Li, Southwest Jiaotong University, China
Prof. Jie Xu, University of Leeds, UK
Integrated Intelligent Systems publishes research that explores the design, development, and deployment of intelligent systems capable of solving complex problems through the integration of multiple technologies and approaches. The journal highlights the synergy of artificial intelligence, machine learning, data analytics, cognitive computing, and embedded systems in creating robust, adaptive, and context-aware solutions. It emphasizes both theoretical advances and real-world applications across various domains, including cybersecurity, autonomous systems, healthcare, manufacturing, and smart infrastructure.
AI and Digital Ethics is a peer-reviewed journal that explores the ethical, social, and legal dimensions of artificial intelligence and digital technologies. The journal provides a platform for interdisciplinary research and discussion, aiming to promote responsible innovation, inform policy, and enhance understanding of the societal impact of AI and emerging digital tools. Contributions are invited from anyone involved in promoting ethical and responsible development of technology.
Advanced Packaging and Electronic Materials (APEM) is an international, peer-reviewed journal dedicated to publishing high-quality research on advanced materials, technologies, and processes that enable next-generation electronic packaging and integration. The journal focuses on the design, fabrication, characterization, and reliability of materials and structures used in electronic and microelectronic systems, addressing challenges related to performance, miniaturization, thermal management, and system integration.
