The International Journal on Social Computing and Social Intelligence (The SCSI Journal) is a peer reviewed, openaccess, interdisciplinary journal publishing original research at the interface of the computational and social sciences. The journal pursues two complementary aims — understanding society through computation, and serving people through intelligence. It addresses an international audience of researchers and practitioners in computer science, artificial intelligence, sociology, management, communication, economics, psychology, public policy, and complexity science, and particularly encourages work grounded in platforms, populations, and institutional settings underrepresented in the existing literature.
Editors-in-Chief
Prof. Xiaofeng Meng, Renmin University of China, China
Frontiers of Embodied Intelligence (FEI) is a premier, fully open-access journal dedicated to the rapidly advancing field of artificial intelligence systems that perceive, reason, and act within physical or virtual environments. This journal aims to bridge the gap between artificial intelligence, robotics, and cognitive science by providing a unified platform for groundbreaking research on agents that learn and interact through physical embodiment. We seek to publish high-impact work that explores foundational models, learning paradigms, multimodal perception, and real-world applications, fostering a community dedicated to developing safe, interactive, and intelligent systems.
Editors-in-Chief
Prof. Tianrui Li, Southwest Jiaotong University, China
Prof. Jie Xu, University of Leeds, UK
Advanced Packaging and Electronic Materials (APEM) is an international, peer-reviewed journal dedicated to publishing high-quality research on advanced materials, technologies, and processes that enable next-generation electronic packaging and integration. The journal focuses on the design, fabrication, characterization, and reliability of materials and structures used in electronic and microelectronic systems, addressing challenges related to performance, miniaturization, thermal management, and system integration.
