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Journals View more >
Frontiers of Embodied Intelligence
Editor(s)-in-Chief: Prof. Dr. Tianrui Li & Prof. Dr. Jie Xu
ISSN(Online): N/A

Frontiers of Embodied Intelligence (FEI) is a premier, fully open-access journal dedicated to the rapidly advancing field of artificial intelligence systems that perceive, reason, and act within physical or virtual environments. This journal aims to bridge the gap between artificial intelligence, robotics, and cognitive science by providing a unified platform for groundbreaking research on agents that learn and interact through physical embodiment. We seek to publish high-impact work that explores foundational models, learning paradigms, multimodal perception, and real-world applications, fostering a community dedicated to developing safe, interactive, and intelligent systems. 


Editors-in-Chief

Prof. Tianrui Li, Southwest Jiaotong University, China

Prof. Jie Xu, University of Leeds, UK

Social Computing and Social Intelligence
Editor(s)-in-Chief: Prof. Dr. Xiaofeng Meng
ISSN(Online): N/A

Social Computing and Social Intelligence (SCSI) is a premier international journal dedicated to publishing cutting-edge research at the nexus of advanced data intelligence techniques, social computing systems, and the rigorous study of human behavior. We explore how transformative AI methods can accurately model, analyze, and ethically shape complex socio-technical phenomena.


Editors-in-Chief

Prof. Xiaofeng Meng, Renmin University of China, China

Advanced Packaging and Electronic Materials
Editor(s)-in-Chief: Pending Online
ISSN(Online): N/A

Advanced Packaging and Electronic Materials (APEM) is an international, peer-reviewed journal dedicated to publishing high-quality research on advanced materials, technologies, and processes that enable next-generation electronic packaging and integration. The journal focuses on the design, fabrication, characterization, and reliability of materials and structures used in electronic and microelectronic systems, addressing challenges related to performance, miniaturization, thermal management, and system integration.

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