Advanced Packaging and Electronic Materials (APEM) aims to publish high-quality research on materials, technologies, and processes that support the development of advanced electronic packaging and integrated electronic systems. The journal focuses on innovations that enhance device performance, reliability, thermal management, and system integration.
The journal welcomes original research and review articles related to, but not limited to, the following topics:
Advanced electronic packaging and heterogeneous integration
Electronic and functional materials for microelectronics
Interconnect, bonding, and assembly technologies
Thermal management and reliability of electronic systems
Wafer-level and panel-level packaging
Flexible and printed electronics
Packaging technologies for power electronics, RF devices, MEMS, and photonics
